Notes:（備註）

1. 1. All dimension units are millimeters.（所有標註尺寸單位爲毫米）
2. 2. All dimension tolerance is ±0.15mm unless otherwise noted.（除特別標註外，所有尺寸允許公差±0.15mm ）

3. Cautions注意事項

   , the pressure on the silicone resin should be proper.

   LED封裝爲矽膠，故LED膠體表面較軟，用力按壓膠體表面會影響LED可靠性，因此應有預防措施避免在封裝的零件上的強大壓力，當使用吸嘴時，膠體表面的壓力應是恰當的。

    

    

    

   Handling Precautions處理防備措施

   Compare to epoxy encapsulant that is hard and brittle,,, Special handling precautions must be observed during assembling using sili- cone encapsulated LED products, Failure to comply might leads to damage and premature failure of the LED.

   相對環氧樹脂較脆較硬而言，矽膠封裝較柔軟且有彈性，雖然它的特性大大減少了熱應力，但易受機械外力損壞，因此在手工處理方面須要對矽膠封裝材料做預防措施，若未按要求操作，可能會導致LED損壞和光衰

    

   1. Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or Handle the silicone lens surface, it may damage the internal circuitry.

   通過使用適當的工具從材料側面夾取，不可直接用手或尖銳金屬壓膠體表面，它可能會損壞內部電路

    

    

    

    

    

    

    

    

    

    

    

    

   2. The outer diameter of the SMD pickupnozzleshould not exceed the size of theLED be

   -and-place machine to insure precise pickup and avoid damage during production.

   爲防止氣壓泄漏，SMD吸咀外徑不可以超過LED尺寸，吸咀內徑尺寸應儘可能大，吸咀頂端材質建議採用柔軟材料以防在吸取期間刮傷或損壞LED膠體表面，元件的尺寸必須在取放機裏準確的編程好，以確保精確的吸取和避免生產過程中的損害

    

    

    

   3.  damage the internal circuitry

   不可將模組材料堆積在一起，它可能會損壞內部電路

   4. Not suitable to operate in acidic envi- ronment, PH<7

   不可用在PH<7的酸性場所

    

    

    

    

    

    

    

    

    

   5. LED operating environment and sulfur element composition cannot be over 100PPM in the LED mating usage material.

   LED工作環境及與LED適配的材料中硫元素及化合物成份不可超過100PPM

    

    

    

    

   6. When we need to use external glue for LED application products,,as most ofLEDpackaging glue is silica gel, and it has strong Oxygen permeability as well as strong moisture permeability; in order to prevent ex- ternal material from getting into the inside of LED, which may cause the malfunction of LED, the single content of Bromine element is required to be less than 900PPM,the single content of CYTorine element is required to be less than 900PPM,the total content of Bromine element and CYTorine element in the external glue of the application products is required to be less than 1500PPM

   當我們需要使用外封膠塗抹LED產品時，應確保外封膠與LED封裝膠水相匹配，因爲大多數LED的封裝膠水爲矽膠，它有較強的氧化性和較強的吸溼性，必須防止外封材質進入LED內部以造成LED的損傷，單一的溴元素含量要求小於900PPM，單一氯元素含量要求小於900PPM，在塗抹LED產品時要求外封膠溴元素與氯元素總含量必須小於1500PPM

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

    

   7. Other points for attention, please refer to our LED user manual.

   其他注意事項請參照我們的LED使用手冊

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